Nano Materials International Corp.

Articles by Nano Materials International Corp.

NMIC ships 10,000th aluminum diamond heat spreader for GaN devices

February 6, 2013

Nano Materials International Corp. (NMIC) announced that it has shipped its 10,000th aluminum diamond metal matrix composite (MMC) heat spreader for use in gallium nitride (GaN) RF power transistors and MMICs.

NMIC Introduces Industry’s First Aluminum Diamond Heat Spreader Material for GaN Devices

August 23, 2011

Nano Materials International Corp.

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Nano Materials International Corp. (NMIC) introduced the first commercial device-level solution for dissipating the heat generated by high density semiconductor devices, such as gallium nitride (GaN) RF power transistors. When used as a heat spreader integrated with a device, NMIC’s new aluminum diamond metal matrix composites (MMCs), have demonstrated...