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NMIC ships 10,000th aluminum diamond heat spreader for GaN devices
February 6, 2013
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Nano Materials International Corp. (NMIC) announced that it has shipped its 10,000th aluminum diamond metal matrix composite (MMC) heat spreader for use in gallium nitride (GaN) RF power transistors and MMICs.
NMIC Introduces Industry’s First Aluminum Diamond Heat Spreader Material for GaN Devices
August 23, 2011
Nano Materials International Corp. (NMIC) introduced the first commercial device-level solution for dissipating the heat generated by high density semiconductor devices, such as gallium nitride (GaN) RF power transistors. When used as a heat spreader integrated with a device, NMIC’s new aluminum diamond metal matrix composites (MMCs), have demonstrated...
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