Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new laterally diffused metal oxide semiconductor (LDMOS) transistor targeting land mobile radio from Freescale Semiconductor Inc.
Custom MMIC, (www.CustomMMIC.com), a developer of performance-driven monolithic microwave integrated circuits, announces the introduction of the CMD172, a new voltage-variable attenuator (VVA) in die form operating from 18 to 40 GHz.
ABI Research reports that Broadcom has put into production one of the world’s smallest multimode (GSM/GPRS/EDGE/UMTS) transceivers. The sub 7 sq. mm. 40nm RF chip (BCM2193) was revealed just one week after the discovery of the 40nm RF chip announced last week. Broadcom’s chip was discovered second but it may actually have hit production a week or two prior to the Mediatek solution.
Comtech Xicom Technology Inc., a technology leader in high-power amplifier products for satellite communications (SATCOM), introduced a compact and highly efficient GaN-based amplifier for X-band MILSATCOM service. Model XTSLIN-100X-B1 features 100 W of WGS linear power in a compact, rugged thirty-two pound package.
M/A-COM Technology Solutions Inc. (M/A-COM), a supplier of high performance analog semiconductor solutions, introduced a new limiter diode designed for passive limiter control circuits in L- and S-Band applications.
AR RF/Microwave Instrumentation has introduced the Model 350AH1 solid state amplifier. This portable, self-contained, 350 watt/10 Hz to 1 MHz unit provides power, durability and dependability along with the versatility for a wide range of applications.
ON Semiconductor has introduced a new family of tunable RF components (TRFC) that address the design challenges faced by engineers developing the latest generation smartphones. The new devices optimally combine tuning range, RF quality factor (Q) and frequency operation, providing a superior solution to existing fixed approaches.
Advantech Wireless Inc., a privately-held Canadian corporation and manufacturer of satellite, RF equipment and microwave systems, announced that it has received new orders in excess of $2M for its high power, high linearity GaN based SSPA line, covering both C-Band and Ku-Band.
This was the first year at the new venue for Mobile World Congress taking place at the Fira Gran Via. The new venue has eight large halls laid out in a linear fashion (hard to know if you count Hall 8 and 8.1 as two of not). The top floor ran over all of the halls making it easy to get from one place to the next despite the large crowds of people. There were also nice outdoor garden areas along the concourse for networking. The show formally announced that 72,000 people attended the show making it by far the largest wireless show in the world.