JETCOOL Technologies unveiled a new approach to cooling computer processors and other electronics at the 2019 IEEE International Microwave Symposium (IMS2019), winning the MIT spin-off the title of Next Top Startup. JETCOOL is aiming for the technology to change the way the world cools the electronics powering aerospace, electric vehicles and AI data centers.
Known as microconvective cooling, the cooling technology uses small fluid jets that can be built within the electronic device. The result is 10x better cooling than today's state-of-the-art and welcome news for overclocking applications and high-power semiconductor companies, according to JETCOOL. CEO Bernie Malouin said the technology can build the heat sink into the silicon substrate, integrating cooling into the processor chip.
“Many of our favorite services run on processors that could do even more, but they get too hot. With better cooling, we hope to break that logjam and help technology companies create a new wave of devices that will power tomorrow's extraordinary innovations.” — Bernie Malouin, JETCOOL's CEO
JETCOOL introduced the company's cooling products at IMS2019 in Boston, which brought more than 9,400 attendees and 600 companies exhibiting. JETCOOL received the top honors among startups, named the Next Top Startup by a panel of judges that included VCs and technology executives. The company also won the audience choice award for the best new technology startup.
Based in Littleton, Massachusetts, JETCOOL Technologies was formed to provide better and smaller cooling solutions for high power electronics.