Cascade Microtech Inc., a leader at enabling precision measurements of integrated circuits at the wafer level, and imec, a world-leading nanoelectronics research center, announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.
M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, announced a new MMIC power amplifier for high power broadband applications.
Peregrine Semiconductor Corp. announced it is expanding its family of MultiSwitch™ STeP8 dual single-pole, seven throw (SP7T/SP7T) UltraCMOS® antenna switches optimized to solve the significant carrier aggregation challenges of 4G mobile wireless applications.
Vishay Precision Group Inc. announced that its Vishay Foil Resistors brand released a new ultra-high-precision Z1-Foil flip-chip resistor, the FRFC 0805, with exceptional load-life stability of ±0.005% (50 ppm) at 70°C and rated power for 2,000 hours; and low typical TCR of ±0.05 ppm/°C from 0° to +60°C.
Custom MMIC announces the addition of the CMD190 to its growing MMIC library of standard products. The CMD190 is a highly efficient GaAs MMIC ultra low noise amplifier for applications from 33 to 45 GHz.
GaN power amplifiers are driving demand for increased power handling from supporting passive components, and Marki Microwave is responding with new high power bias tees and baluns. The new high power surface mount baluns (BALH-0003SMG and BALH-0006SMG) have a 37 dBm 1 dB compression point and improved 5 dB insertion loss (2 dB excess).
MicroGen Systems announced that vibration energy harvesting BOLT™ Power Cells enabled a live wireless sensor network (WSN) using Linear’s Dust Networks LTC5800-IPM SmartMesh™ IP mote-on-chip at the Sensors Expo and Conference exhibition in Rosemont, IL on June 5-6, 2013.