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Software/EDA Channel

Expert Tips, Tricks and Techniques

Invited seasoned and well-respected professionals share their tips, tricks and techniques


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Remcom announces training in San José and Ottawa

Remcom, provider of electromagnetic simulation software and solutions, announces two public training courses in San José, California, and Ottawa, Ontario, Canada. Both sessions will include two-day product tracks for XFdtd® and Wireless InSite®, as well as a personal workshop option for those that want to work with Remcom’s engineers one-on-one.


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CST pushes boundaries for model complexity

Computer Simulation Technology AG (CST) announces enhancements to the transient solver of CST MICROWAVE STUDIO® at MTT-S IMS 2012.


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Agilent debuts breakthroughs in PA design for next release of ADS

Agilent Technologies Inc. unveiled new technologies and breakthroughs for RF power amplifier design. These capabilities and more will be part of the next major release of Agilent’s flagship Advanced Design System.


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Practical Integrated Passive Device Technology on GaAs

Development of a low cost, compact integrated Passive Device technology including process description and example devices


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Eye on EDI CON

Highlights the upcoming EDI CON 2013 conference and trade show that will take place in Beijing in 2013
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Agilent's newest 3D-EM software release increases integration with circuit design flow

Agilent accelerates early wireless design verification with new SystemVue release

Agilent Technologies Inc. announced a new release of SystemVue, Agilent’s premier platform for designing communications systems.


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Agilent's newest GoldenGate software release accelerates design verification

EDAFocus

Agilent GoldenGate, Reproduced with Permission, Courtesy of Agilent Technologies Inc.Agilent Technologies Inc. announced the latest release of its RFIC simulation, verification and analysis software, GoldenGate 2012.


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AWR highlights software demos at IMS 2012

Visit AWR at the Booth #1514 to see Analyst™ - 3D EM technology for bumps, bond wires, tapered vias and more - and the latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for MMIC, RFIC, RF PCB and module design.


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