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COMSOL, the leading provider of multiphysics modeling, simulation, and application design software, announced support for app development in the latest version of LiveLink™ for SOLIDWORKS®. Part of COMSOL Multiphysics® software, the only fully integrated environment for creating custom simulation applications, LiveLink™ for SOLIDWORKS® connects COMSOL® software simulations and 3D design and its latest version allows users to build apps with the Application Builder. 

Keysight Technologies, Inc. announced the latest release of its industry leading, affordable RF simulation and synthesis software, Genesys 2015. Designed for circuit and system designers, the software features breakthrough Keysight Sys-Parameters that enables RF system simulation with off-the-shelf component datasheets; and comprehensive RF circuit synthesis to enable the industry’s fastest realization of RF systems and circuits.

Keysight Technologies, Inc. announced that CEPREI Laboratory has successfully adopted the Keysight EEsof EDA E4727A Advanced Low-Frequency Noise Analyzer(A-LFNA) for measurement and analysis of flicker noise (1/f noise) and random telegraph noise (RTN) during its reliability studies of semiconductor devices including MOSFETs, HEMTs and TFTs.

Anritsu Corp. has announced the availability of three new measurement software packages expanding the functions of the MT8870A Universal Wireless Test Set to support manufacturing tests of IoT/M2M applications.

X-COM Systems LLC, a subsidiary of Bird Technologies, introduced the latest version of its Windows-based Spectro-X signal analysis software that adds new features to tools for developing and testing radar, ELINT, SIGINT, ECM, ESM, commercial and military communications systems. The latest version of the software makes it easier to quickly find signals of interest and pinpoint them in time, enhanced broader pulse signal analysis and waveform search capability, and filtering of export files to include only specific signals.

Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.

Keysight Technologies Inc. introduced the Keysight Distinguished University Program; a program designed to identify and acknowledge educational excellence in creating industry-ready engineers. The program provides a strong level of cooperation and support between each participating University and Keysight. The program also creates a process to engage students in industry-related projects based on the latest technologies.

Modelithics Inc. released a new version of The Modelithics^® COMPLETE Library, version 12.3, for use with the Keysight EEsof EDA Genesys RF simulation and synthesis software from Keysight Technologies.

COMSOL is excited to announce the availability of COMSOL Multiphysics® software on Rescale™ simulation platforms through a collaboration with COMSOL, creators of the robust, physics-based modeling and simulation software.

Sonnet Software Inc. introduces Sonnet Suites 16 (V16), enabling integration with the Modelithics^® CLR Library for Sonnet, along with speed increases in larger projects, and new features that give users more control and automation for their designs.