The Economics of GaAs and CMOS PAs: Crunch Time
Design and Test Challenges for Next-Generation 802.11ac, ad WLAN Standards
CoMP: The Most Challenging Technology Component in LTE-Advanced 3GPP Release 11
The interface between the FEKO 3D electromagnetic simulator and the Optenni Lab matching circuit optimization software has been extended with a new layer of automated workflow.
Optenni Ltd. announces a new link between ANSYS® HFSS™ and Optenni Lab™ for designing matching circuits for antennas and other RF components based on 3D models simulated using the HFSS electromagnetic field simulation software.
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