Rogers Advanced Circuit Materials (ACM) Division employees will be at IMAPS Device Packaging 2010, offering information on ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® circuit board materials, including the recently launched RO4360™ laminate (6.15 Dk), which many in the field believe is a very effective cost-down replacement for LTCC (low temperature co-fired ceramic) packaging designs.
RF Micro Devices introduced three new products – the RF7170, RF7171, and RF7172, expanding RFMD's industry-leading family of dual- and quad-band GSM/GPRS transmit modules. The RF71xx family of transmit modules is the industry's highest volume GSM/GPRS transmit module product family.
The COMSOL Reaction Engineering Lab uses reaction formulas to create models of reacting systems. It solves the material and energy balances for such systems, including reaction kinetics, where the composition and temperature vary only with time.