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Traditional capacitor and inductor models have consisted of two or three elements (capacitor examples are shown in Figure 1 ). The two-element models provide a simple way to define the device. From a circuit designer's viewpoint, the two-element models may suffice for applications where the component is being used...

As this article is written, it is estimated that 90 to 98 percent of first-level IC interconnects are made using wire bonding technologies. The remaining connections are primarily bump, or flip-chip connections. This ratio is expected to remain the same for the foreseeable future. In general, it will be...

Coplanar waveguide probes, also referred to as coplanar probes, are the method of choice for launching RF signals on and off a wafer. This article explains their construction, RF characteristics and proper usage. Before the advent of coplanar probes, finding the RF behavior of a die on a wafer...

In a contract worth approximately US$3 M, AMS, an equal shares joint venture between Finmeccanica of Italy and BAE Systems of the UK, has signed a contract with the Civil Aviation Authority of China (CAAC) to supply two mono-pulse versions of SIR-S, the AMS Mode-S Secondary Radar, to be...

Committed to advancing the use of indium phosphide (InP) for IC applications, Vitesse Semiconductor Corp. announced it is the first company to provide InP HBT foundry services through MOSIS, a leading provider of low cost prototyping and small-volume production services for IC (and optical IC) development. By working directly...

MEMGen Corp. has launched the world's first micro-device design contest. The "3-D MEMS Design Challenge" is made possible by the company's proprietary EFAB™ micro-manufacturing technology, which allows micro-devices to be designed with commonly available 3-D CAD software tools and fabricated in a matter of a few weeks using the...

Although the economy has continued to impact the Bluetooth semiconductor market, it will experience high growth, according to In-Stat/MDR. With recent, adjusted outlooks of shipments by vendors, and a gradual expected up-tick in the economy in 2003, the high tech market research firm expects final 2002 chipset shipment figures...

In order to meet the objective of providing short-range air defense throughout Switzerland, Lockheed Martin has signed a contract with the Swiss Defense Procurement Agency to provide 24 Portable Search and Target Acquisition Radars (PSTAR). Typically, PSTAR interfaces with a weapons system such as a Stinger anti-aircraft missile. This...

The UK Defence Communications Services Agency (DCSA) has awarded BAE Systems C4ISR a contract for the supply of an additional two Dagger vehicle-borne and two Talon man-portable high capacity satellite communications systems to support British Forces' network enabled capabilities (NEC) during field operations. This will mean that following delivery...

With the aim of accelerating the migration from second- to third-generation networks in China, Datang Mobile, Royal Philips Electronics and Samsung Electronics have formed a joint venture company, named T3G. The company will design and license core TD-SCDMA chipsets and reference designs for mobile terminals and end-user equipment. The...