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Articles Tagged with ''micron''
SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, offers PIN diodes that feature low capacitance and resistance, high reliability, and easy bonding with F.A.C. mesas.
RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has signed a
Micron Technology Inc., one of the world's leading providers of advanced semiconductor solutions, announced its collaboration with Broadcom Corp. to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.
The productronica is an important trade fair for LPKF Laser & Electronics AG. In time for the opening, the specialist in micro-material processing presented new systems and procedures
The productronica is an important trade fair for LPKF Laser & Electronics AG. In time for the opening, the specialist in micro-material processing presents four new systems and procedures
Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”.
e2v aerospace and defense Inc.(e2v a&d announces a life extension program for selected Micron Technology Inc. memory devices.
e2v aerospace and defense Inc. (e2v a&d), a leader in RF power, imaging and hi-rel semiconductor solutions, announced a life extension program for selected memory devices of Micron Technology Inc. (Micron), one of the world’s leading providers of advanced memory solutions.
Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.