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Articles Tagged with ''micron''

Advanced Microcircuit Metallization Process

 

Metallization ServicesMetrigraphics announced it has developed an advanced process for applying metal layers to circuit substrates and to polyimide layers on multilayer circuits. The process works for both rigid and flexible circuits. Metallization layers can range in thickness from 10 microns to over 100 microns. Substrates can range up to 12” X 12” or 144 square inches.


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Low Capacitance PIN Diodes

SemiGen_PINdiodes_PR (2)SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, offers PIN diodes that feature low capacitance and resistance, high reliability, and easy bonding with F.A.C. mesas.


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RFMD awarded $9.7M Air Force contract to produce MM Wave GaN integrated circuits

RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has signed a $9.7 million agreement with the Manufacturing and Industrial Technologies Directorate within the Air Force Research Laboratory (AFRL) to transfer and produce a 0.14 micron Gallium Nitride (GaN) monolithic microwave integrated circuit (MMIC) technology. The technology will be scaled to 6-inch diameter wafers using RFMD's industry-leading 6-inch GaN-on-Silicon Carbide (SiC) manufacturing line.


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Micron collaborates with Broadcom to solve DRAM timing challenge

Micron Technology Inc., one of the world's leading providers of advanced semiconductor solutions, announced its collaboration with Broadcom Corp. to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.


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LPKF presents wave of innovation at productronica fair

The productronica is an important trade fair for LPKF Laser & Electronics AG. In time for the opening, the specialist in micro-material processing presented new systems and procedures 


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LPKF presents four new systems at productronica fair

The productronica is an important trade fair for LPKF Laser & Electronics AG. In time for the opening, the specialist in micro-material processing presents four new systems and procedures


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UltraSource releases capabilities addition on ultra-thin substrates

Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering  thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”. 


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e2v aerospace and defense provides life extension program for Micron products

e2v aerospace and defense Inc.(e2v a&d announces a life extension program for selected Micron Technology Inc. memory devices.


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e2v announces life extension program for Micron

e2v aerospace and defense Inc. (e2v a&d), a leader in RF power, imaging and hi-rel semiconductor solutions, announced a life extension program for selected memory devices of Micron Technology Inc. (Micron), one of the world’s leading providers of advanced memory solutions.


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Ohmega Technologies introduces OhmegaPly MTR thin film resistor material

Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.


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