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Articles Tagged with ''booth''

Richardson RFPD to exhibit at IMS 2012

June 11, 2012

Richardson RFPD Inc. announces its attendance and participation at the 2012 IEEE International Microwave Symposium (IMS). IMS, along with the RFIC symposium and the ARFTG conference, is part of Microwave Week, the largest gathering of radio frequency (RF) and microwave professionals, and the most important forum for the latest and most advanced research in these fields.


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RFMD to exhibit at IMS 2012

June 12, 2012

Explore the RFMD® industry-leading RF and microwave product portfolio in booth 1210, with kiosks featuring solutions for WiFi and smart energy, wireless infrastructure, GaN RF power, microwave MMICs, and custom foundry services.

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M/A-COM Tech showcases new products at MTT-S 2012

June 13, 2012

M/A-COM Technology Solutions (M/A-COM Tech) is showcasing a broad portfolio of new products for wireless backhaul, CATV, optical communications, and aerospace and defense applications at the IEEE/MTT-S International Microwave Symposium tradeshow in Montréal, Canada. New product solutions on display in M/A-COM Tech’s Booth #815 include: 


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Sumitomo premiers MMICs for radio link applications at IMS 2012

June 13, 2012

Sumitomo Electric Device Innovations USA Inc. (SEDU), a provider of advanced wireless and optical communications solutions, will showcase its E-band MMICs for radio link applications at IMS 2012 in Montreal.


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StratEdge introduces laminate packages for high power devices

June 13, 2012

StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).


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SEDU to demo GaN HEMTs for S- and X-Band radar Applications at IMS 2012

June 15, 2012

Sumitomo Electric Device Innovations USA Inc. (SEDU) will be showing its full line of GaN HEMTs at this year’s MTT-S IMS 2012 Show in Montreal. 


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Rogers to highlight material solutions spanning RF to digital at the 2012 IPC Midwest Show

August 8, 2012

Rogers Corp. will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference (www.ipcmidwestshow.org) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.


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SemiGen showcasing PCB assembly capabilities at SMTA

October 9, 2012

SemiGen Inc., (www.semigen.net), an ISO and ITAR certified RF/Microwave assembly and automated PCB manufacturing company, has announced that they will be exhibiting at the SMTA International Conference in Orlando, Florida, October 14th-18th in Booth #251.


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ANSYS to exhibit at EuMW 2012

October 9, 2012

Come and meet with your simulation experts on ANSYS booth # 616A at EuMW 2012. Get a demo of the company's latest versions HFSS 15.0, Designer 8.0. Talk about HPC and more.


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AWR continues sponsorship of MicroApps program at EuMW 2012, presents six papers

October 12, 2012

AWR Corp., the innovation leader in high-frequency EDA software, is proud to sponsor for the second year in a row the MicroApps Program at European Microwave Week 2012, being held in Amsterdam October 28th through November 2nd.


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