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Articles Tagged with ''thermal''

Ball Aerospace Green Propellant Mission to test new thermal insulation

NASA’s Green Propellant Infusion Mission (GPIM) has been selected to test an advanced form of thermal insulation, called integrated multi-layer insulation (IMLI) that could become standard on future satellites and cryogenic subsystems. Validating this new insulation in space will help NASA build the technology required for long human spaceflight missions. Under a subcontract from Ball Aerospace & Technologies Corp., Quest Thermal Group LLC will manufacture the new insulation that will fly aboard the 2015 GPIM mission.


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Isola introduces low loss, low skew, high-speed materials for PCB fabrication

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board. 


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EMC Technology introduces CVD diamond heat spreaders

Following the success of the Diamond RF Resistives® product range, EMC Technology now offers CVD Diamond Heat Spreaders designed to meet today’s demanding requirements for higher power and longer life spans by keeping junction temperatures low and stable. CVD Diamond provides up to 8x the thermal conductivity of traditional materials like AlN and BeO.


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Nitronex qualifies rugged NPT1015 transistor

Nitronex, a leader in the design and manufacture of gallium nitride (GaN) based RF solutions for high performance applications in the defense, communications, cable TV, and industrial & scientific markets, has fully-qualified the robust NPT1015 transistor. The NPT1015 is a 28V, DC to 2.5 GHz, 50 W power transistor with 15 dB saturated gain and 65% peak drain efficiency at 2 GHz.


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