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Articles Tagged with ''thermal''

EMC Technology introduces CVD diamond heat spreaders

June 11, 2013

Following the success of the Diamond RF Resistives® product range, EMC Technology now offers CVD Diamond Heat Spreaders designed to meet today’s demanding requirements for higher power and longer life spans by keeping junction temperatures low and stable. CVD Diamond provides up to 8x the thermal conductivity of traditional materials like AlN and BeO.


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Rogers launches high frequency laminate material with improved thermal reliability for higher MOTs

May 30, 2013

Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).


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Nitronex qualifies rugged NPT1015 transistor

May 29, 2013

Nitronex, a leader in the design and manufacture of gallium nitride (GaN) based RF solutions for high performance applications in the defense, communications, cable TV, and industrial & scientific markets, has fully-qualified the robust NPT1015 transistor. The NPT1015 is a 28V, DC to 2.5 GHz, 50 W power transistor with 15 dB saturated gain and 65% peak drain efficiency at 2 GHz.


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Laird Technologies to exhibit wireless solutions at CTIA 2013

May 9, 2013

Laird Technologies Inc., a global technology company, will exhibit solutions for the wirelessly connected world at CTIA 2013. Embedded wireless, active thermal management and telematics products will be on display, allowing Laird to showcase a range of wireless capabilities. The CTIA Conference and Exhibition will be held at the Sands Expo and Convention Center in Las Vegas, May 21-23. Laird will exhibit at booth #6136.  


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API Technologies expands high performance PA line

April 18, 2013

API Technologies Corp., a provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, has expanded its power amplifier line of products to include the latest in GaN technology driven designs. This expanded line is specially intended for use in electronic warfare, RCIED countermeasures, and national security jammer applications where the use of rugged and highly reliable power amplifier designs is mission critical.


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NMIC ships 10,000th aluminum diamond heat spreader for GaN devices

February 6, 2013

Nano Materials International Corp. (NMIC) announced that it has shipped its 10,000th aluminum diamond metal matrix composite (MMC) heat spreader for use in gallium nitride (GaN) RF power transistors and MMICs.


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Linear's 140 V precision op amp features 3 pA bias current, 3.5 µVP-P noise

January 30, 2013

Linear Technology announces the LTC6090, a precision operational amplifier that operates on a supply voltage up to 140 V (or ±70 V). Its combination of rail-to-rail output, 3 pA (typical) input bias current, 1.6 mV maximum input offset voltage and 3.5 µVP-P low frequency noise delivers the precision required for high performance ATE, piezo driver, and DAC buffer applications.


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Laird Technologies releases two new Tflex™ Series products

December 6, 2012

Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of two new Tflex™ series thermal gap fillers.  


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inTEST launches THERMOSTREAM ATS Series

December 5, 2012

inTEST Corp., an independent designer, manufacturer and marketer of temperature management products and semiconductor automatic test equipment (ATE) interface solutions, announced that its Thermal Solutions Group has launched the industry’s most comprehensive line of Precision Temperature Forcing Systems, the THERMOSTREAM® ATS Series. With temperature range extremes as high as +300ºC (+570ºF) and as low as -100ºC (-148ºF), countless test and conditioning applications can now be solved with a compact, precise and portable system.


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Maury Microwave launches low-profile and TVAC Stability cable assemblies

November 30, 2012

Maury Microwave announces the expansion of its Stability™ family of amplitude- and phase-stable cable assemblies to include Low-Profile (-LP) and Thermal Vacuum (-TVAC) models.


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