Element Six, a leader in synthetic diamond supermaterials and a member of the De Beers Group of Companies, announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Co. to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices—reducing thermal resistance, increasing RF power density, and preserving RF functionality.
TEGAM Inc., a leading supplier of innovative RF power measurements, was recently awarded Patent No. 8,558,556, “Planar-axial thermistor for bolometry.” This patent describes a novel way to construct very small planar thermistors on a substrate with very low heat transfer. The thermistors are more thermally isolated from the environment than are commercially-produced thermistors. Both the small size and thermal isolation make them useful for measuring RF power at microwave frequencies up to 70 GHz.
Richardson RFPD Inc. announces its attendance and participation at the 2014 Applied Power Electronics Conference and Exposition (APEC). APEC focuses on the practical and applied aspects of the power electronics business, and it draws attendance from all facets of the industry, from manufacturers, designers and suppliers, to individuals involved in marketing and sales.
NASA’s Green Propellant Infusion Mission (GPIM) has been selected to test an advanced form of thermal insulation, called integrated multi-layer insulation (IMLI) that could become standard on future satellites and cryogenic subsystems. Validating this new insulation in space will help NASA build the technology required for long human spaceflight missions. Under a subcontract from Ball Aerospace & Technologies Corp., Quest Thermal Group LLC will manufacture the new insulation that will fly aboard the 2015 GPIM mission.
Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), is introducing a free, easy-to-use, Thermal Analysis tool to their array of web-based calculators. The company offers Attenuator, Image Rejection, Cascade Analysis, and now Thermal calculators.
Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England. ECOC is the largest European optical communications event for the fiber optic industry.
DiTom Microwave has received a contract from a major U.S. satellite manufacturing company for thermal vacuum (TVAC) compatible X- and Ka-Band isolators. Under the contract agreement, DiTom will supply ferrite isolators for the Wideband Global Satcom (WGS) program.