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Articles Tagged with ''thermal''
Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board.
At SEMICON West 2013, Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year.
Following the success of the Diamond RF Resistives® product range, EMC Technology now offers CVD Diamond Heat Spreaders designed to meet today’s demanding requirements for higher power and longer life spans by keeping junction temperatures low and stable. CVD Diamond provides up to 8x the thermal conductivity of traditional materials like AlN and BeO.
Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).
Nitronex, a leader in the design and manufacture of gallium nitride (GaN) based RF solutions for high performance applications in the defense, communications, cable TV, and industrial & scientific markets, has fully-qualified the robust NPT1015 transistor. The NPT1015 is a 28V, DC to 2.5 GHz, 50 W power transistor with 15 dB saturated gain and 65% peak drain efficiency at 2 GHz.
Laird Technologies Inc., a global technology company, will exhibit solutions for the wirelessly connected world at CTIA 2013. Embedded wireless, active thermal management and telematics products will be on display, allowing Laird to showcase a range of wireless capabilities. The CTIA Conference and Exhibition will be held at the Sands Expo and Convention Center in Las Vegas, May 21-23. Laird will exhibit at booth #6136.
API Technologies Corp., a provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, has expanded its power amplifier line of products to include the latest in GaN technology driven designs. This expanded line is specially intended for use in electronic warfare, RCIED countermeasures, and national security jammer applications where the use of rugged and highly reliable power amplifier designs is mission critical.
Nano Materials International Corp. (NMIC) announced that it has shipped its 10,000th aluminum diamond metal matrix composite (MMC) heat spreader for use in gallium nitride (GaN) RF power transistors and MMICs.
Linear Technology announces the LTC6090, a precision operational amplifier that operates on a supply voltage up to 140 V (or ±70 V). Its combination of rail-to-rail output, 3 pA (typical) input bias current, 1.6 mV maximum input offset voltage and 3.5 µVP-P low frequency noise delivers the precision required for high performance ATE, piezo driver, and DAC buffer applications.
Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of two new Tflex™ series thermal gap fillers.