Bonding Source, the industry’s leading supplier of epoxy pastes and films for the RF Microwave industry, introduces the latest from NAMICS for applications requiring high thermal conductivity. The H9890-6A material is an advancement over the existing Diemat offerings. It performs well on production automated dispensing machines, has a longer open time, and thermal conductivity of 100 W/mK. 

Applications include power amplifiers, GaN and GaAs devices and can be used as a replacement for Gold/Tin. As always, the NAMICS H9890-6A is in stock with no minimum charges.  Visit for details.