Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, has appointed Allan Camp as technical training manager.
Camp will provide technical training on Hesse & Knipps’ family of semiconductor packaging equipment including high speed fine pitch wedge bonders and heavy wire bonders. Training will be offered at Hesse & Knipps’ demonstration and applications facilities in Clinton, MA and Anaheim, CA in addition to on-site at customer facilities. Camp will also conduct demonstrations of Hesse & Knipps wedge bonding equipment and related software, enabling customers to validate and qualify wedge bonders prior to making an investment in new technology.
Camp possesses more than two decades of experience in the semiconductor industry, having most recently worked at Eastman Kodak Co. as a microelectronics packaging technician and, previously, at Xerox Corp. as a wafer fab technician. In addition to earning a degree in Electronics Technology, Camp holds a certificate of business degree – management process from Rochester Institute of Technology.
“Allan’s knowledge in wafer fab operations, microelectronics packaging and semiconductor processing equipment will serve our customers well as he provides training that addresses their specific wire bonding equipment and manufacturing requirements,” notes Joseph Bubel, president of Hesse & Knipps.