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ARTICLES

Hesse & Knipps to demo new 3 mil wire bonding capability at IMAPS 2012

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, will demo a new 3 mil wire bonding capability on its BJ935 Fully Automatic Heavy Wire Bonder at the upcoming 45th International Symposium on Microelectronics (IMAPS) in Booth No. 210.


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Hesse & Knipps appoints new technical training manager

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, has appointed Allan Camp as technical training manager.


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Hesse & Knipps to discuss wedge bonding for COB and DCA at SMTA Philadelphia Meeting

Hesse & Knipps GmbH, European headquarters of Hesse & Knipps Semiconductor Equipment GmbH and sister company to Americas subsidiary Hesse & Knipps, Inc., will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the rescheduled SMTA Philadelphia Chapter Meeting now on June 12th at 4:30 p.m. at the Air Products in Allentown, PA.


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Hesse & Knipps Partners with MEW Consulting

Hesse & Knipps , a manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, will partner with MEW Consulting , recently founded by Michael Whitehead, to provide technical support for third-party wedge and wire bonding equipment being phased out by the original manufacturers. Through the partnership,...
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