Hesse Mechatronics Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, formally announces the company’s recent name change from Hesse & Knipps Inc. to Hesse Mechatronics Inc., effective January 1, 2013.
The name change is a move back to the company’s roots, named Hesse GmbH when first launched in 1986. In addition, the new name signifies more accurately what the company does – which is to develop and manufacture the most advanced thin wire wedge bonders and heavy wire bonders in the world, utilizing mechatronics, or a multidisciplinary engineering approach that combines mechanical, electrical, control and computer engineering to achieve the best possible equipment performance.
Information about Hesse Mechatronics and its products is available at www.hesse-mechatronics.com; in addition, wire bonding demonstration videos are available at www.wirebonddemo.com.