Items Tagged with 'wire'

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Carlisle Interconnect Technologies’ (CarlisleIT) president, John Berlin was awarded the 2013 WCMA Distinguished Career Award by the Wire & Cable Manufacturers Alliance Inc. (WCMA) on April 13th, 2013. This award is given to notable individuals in the Wire & Cable industry based on their significant commercial or technical contributions over a minimum 25-year industry career.

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.

Hesse Mechatronics Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, has appointed Michael McKeown as senior business development manager.

Hesse Mechatronics Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, formally announces the company’s recent name change from Hesse & Knipps Inc. to Hesse Mechatronics Inc.

EDI CON organizers have announced six new exhibitors for the show, which is taking place this March 12-14 in Beijing, China. Azimuth Systems, Microwave Vision Group, Times Microwave, Insulated Wire (IW), Southwest Microwave and Tower/Jazz join the list of exhibitors and speakers at this industry-driven high-frequency electronics event.

Carlisle Companies Inc. announced the signing of a definitive agreement to acquire the Thermax–Raydex business, a leading global supplier of high-performance hook-up, data and coaxial wire and cable for mission-critical applications for commercial aerospace, defense and industrial customers.

SemiGen Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the recent addition of key components to their RF Supply Center’s stockroom. The RF Supply Center is now offering PIN and limiter diodes that meet the most common RF/Microwave design specifications.

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, will demo a new 3 mil wire bonding capability on its BJ935 Fully Automatic Heavy Wire Bonder at the upcoming 45th International Symposium on Microelectronics (IMAPS) in Booth No. 210.

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, has appointed Allan Camp as technical training manager.

SemiGen, Inc. has announced today they have placed an order for a Palomar 8000 Auto Ball Bonder to round out their state-of-the-art RF/Microwave assembly line.