Items Tagged with 'boards'

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UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions

UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.


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Registration opens for inaugural Boards, Chips and Packaging IMPACT conference

Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs) and Semico Research, a semiconductor marketing and consulting research company, announced that they have teamed up to launch Boards, Chips and Packaging: Designing to Maximize Results. This new industry event will span the system-level ecosystem to address the roles of system architecture, board design, chip design, package design and final fabrication and assembly processes for hardware product development.


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Liquid-Crystal-Polymer Laminates: ULTRALAM 3850HT

Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.


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TriQuint introduces 27-31 GHz 5 W GaN PA

RFIC

TriQuint's TGA2594 is a Ka-Band power amplifier fabricated on TriQuint's 0.15um GaN on SiC process. Operating between 27 and 31 GHz, it achieves 5 W saturated output power with an efficiency of 28% PAE, and 23 dB small signal gain. Along with excellent linear characteristics, the TGA2594 is ideally suited to support both commercial and defense related satellite communications.


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Isola introduces halogen-free, ultra-low loss materials

Isola Group S.à.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced TerraGreen, the company’s new halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing.


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