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From radio frequency (RF) to millimeter wave, optical, and HSD, translating design specifications into PCB hardware requires the right experience and toolset to interweave the numerous circuit technologies in modern high-frequency electronics. It requires a solid understanding of first principles and the ability to juggle many component inputs and material considerations.
Df is important for prediction of insertion loss in passive devices. If insertion loss is higher than predicted, then power transfer through a device may be too low and a higher power transmitter or more elements would be necessary. Presented here are four methods of extracting Dk and Df from dielectric samples of an unknown material and the pros and cons of each.
A few weeks ago, the FCC issued a Notice of Inquiry to kick off a program for regulating the receivers in wireless communications. This may sound like an arcane and meaningless action to some people. But I congratulate the FCC commissioners for starting this action, as I see this step as absolutely necessary to our 6G future.
Any time that multiple RF systems are co-located, there is an opportunity for RF interference (RFI) to degrade or disrupt the performance of receivers. The impact of RFI includes decreased performance, delayed product releases, product recalls and safety-critical scenarios. RFI is a very serious matter that must be addressed throughout the design of products and systems.
For RF PCBs, however, you need a whole new approach to layout as well as routing, as opposed to low frequency PCBs. In fact, for RF PCBs, it is important to look at the entire circuit as a distributed parameter system.
Using electromagnetic simulation, designers evaluate antennas in-situ. Ansys 3D components offer designers more freedom than they’ve ever had before. Learn about 3D Components and Intellectual Property Protection.
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