Articles by COMSOL, Inc., Burlington, Mass.

MEMS Module

MEMS_ModuleThe design and modeling of microscale electro-mechanical systems (MEMS) is a unique engineering discipline. At small length scales, designs must consider the effects of several physical phenomena. The MEMS Module solves problems that couple structural mechanics, microfluidics, and electromagnetics.


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Plasma Module

PlasmaModuleThe Plasma Module is a specialized tool for modeling non-equilibrium discharges which occur in a wide range of engineering disciplines. The Plasma Module provides tools to add circuit elements directly to a 1D, 2D or 3D model, or import an existing SPICE netlist into the model.


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CFD Module

CFD__ModuleComsol reveals the CFD module which is tailored for advanced flow simulations. Ready-to-use interfaces let you model laminar and turbulent flows in single or multiple phases. Functionality for treating coupled free and porous media flow, stirred vessels, and fluid structure interaction (FSI) are also included.


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Batteries & Fuel Cells Module

Batteries_Fuel_CellsComsol reveals the Batteries & Fuel Cells Module which is a specialized tool designed to model and simulate all types of battery and fuel cell (FC) applications. The Module features tailored general interfaces to study primary, secondary and tertiary current density distributions in electrochemical cells, and specialized interfaces for lithium-ion, nickel-metal hydride and lead-acid battery chemistries.


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CAD Import Module

comsollogo_smGetting your CAD geometries ready for FEA modeling is easier than ever with the CAD Import Module. It facilitates the reading of industry-standard formats such as STEP, IGES, ACIS® (SAT®) or Parasolid®. Extra add-ons support file formats for packages that have their own geometry kernel.


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Heat Transfer Module

Heat_Trans__ModThe Heat Transfer Module provides a combination of simulation capabilities to model heat transfer via conduction, convection, and radiation, as well as the ability to couple these to other physics. With boundary conditions for describing convective and radiative effects, contact resistance, as well as thin highly-conductive shells, you can simulate anything from a simple "back of the envelope" model to a full model with all effects explicitly described.


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