Articles by STMicroelectronics

STMicroelectronics is now supplying its latest long-range (77 GHz) radar chips to leading automotive customers.

STMicroelectronics and Autotalks are preparing to release their second-generation V2X chipset to meet the upcoming U.S. mandate on connected road safety.

STMicroelectronics announced what is claimed to be the world’s first 500 Mbaud High-Symbol-Rate (HSR) satellite demodulator chip.

STMicroelectronics announced its Open.MEMS program to boost time-to-development with quick and easy single-node evaluation licensing, which went live on November 11, 2014, and will be expanded regularly with additional low-level drivers, middleware/libraries and application-layer code.

 STMicroelectronics has shipped 5 billion MEMS sensors, which combined with its total of more than 3 billion micro-actuators shipped, is claimed to demonstrate that ST is the only company with the expertise to cover the full range of micro-machined silicon devices. 

STMicroelectronics and Changan Automobile have set up Changan – ST Automotive Electronic Joint Laboratory to extend the cooperation of the two companies in automotive electronics.

STMicroelectronicsand Samsung Electronics Co., Ltd. have signed a comprehensive agreement on 28 nm Fully Depleted Silicon-on-Insulator (FD-SOI) technology for multi-source manufacturing collaboration.

STMicroelectronicshas launched the first iNEMO^®Design Challenge in Italy, inviting students and engineers to design innovative applications built around the company’s iNEMO smart multi-sensor technology.

STMicroelectronics has announced Teseo III, a single-chip standalone positioning product family capable of receiving signals from multiple satellite navigation systems, including the Chinese BeiDou, the U.S. GPS, European Galileo, Russia’s GLONASS and Japan’s QZSS.

STMicroelectronics announced that its Teseo II single-chip satellite-tracking ICs were successful in the first ground location test using Europe’s Galileo navigation system.