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Ericsson has just released their Mobility Report Nov 2018 and on a global level, they predict major 5G network deployments from 2020 and by the end of 2024 estimate 1.5 billion 5G subscriptions for enhanced mobile broadband. They think this will account for close to 17 percent of all mobile subscriptions at that time. Since the report is more than 30 pages, I thought I would extra some of the overview and devices specific data important to the RF/microwave community.

Skin depth is often used to describe the behavior of current flow through circuit conductors, i.e., the copper on a PCB, especially at RF/microwave frequencies. Direct current (DC) may exhibit evenly distributed flow through a conductor such as copper, but high-frequency, sinusoidal current experiences changing energy density as it flows through a PCB’s conductors, with areas of lower and higher current density relative to the surface of the conductor.

In June, the first 5G specification was finalized as 5G NR phase I (release 15) and next year will see the completion of phase II for the 5G NR specification. 5G started in the U.S. in Oct this year when Verizon released the first commercial 5G service with the deployment of mmWave Fixed Wireless Access service in several cities. AT&T is starting the deployment of the first standards-based 5G mobile service now and T-Mobile plans to start in the first half of 2019. Although it will be several years before 5G becomes prevalent to the consumer around the world, we have to ask what’s next.

Testing 5G components and devices with over-the-air (OTA) methods instead of the cabled methods currently in use will be necessary to validate the performance of 5G technology. As engineering leaders, we need new test methods to ensure the viable commercialization of 5G products and solutions across many industries and applications.

With 5G mmWave technology already deploying in the US, I was glad to oversee the EDI CON USA 2018 5G Symposium in Oct that included a full afternoon of sessions including topics such as the best RF architectures for 5G, semiconductor tradeoffs for 5G mmWave devices, antenna modeling, simulation of fixed wireless access systems, design of a 28 GHz filter and silicon active antennas for mmWave applications.

The use cases and goals of the 5G initiative are well-known. What might not be as well-known is the role and potential use of satellites in the 5G ecosystem. Afterall, there has not been significant discussion on how satellites fit in. For Release 16, the 3GPP initiated a study item focused on the role of satellites in the 5G ecosystem.

Qualcomm and Ericsson first to complete 3GPP-compliant 5G NR Sub-6 GHz and mmWave OTA Call with a Mobile Device.

As explained in the previous ROG Blog, vehicular radars are already being designed and fabricated at millimeter-wave frequency bands such as 77 GHz. Specifiers of circuit materials for millimeter-wave frequencies (30 to 300 GHz) are faced with special requirements that are often different than those for circuits at microwave frequencies of 30 GHz and below. However, practice and experience of circuit designers working at millimeter-wave frequencies has shown that some circuit material parameters can be tightly linked to achieving high performance in millimeter-wave circuits, and that some circuit materials embody the material parameters as needed for excellent performance at 77 GHz and beyond.

At its annual conference, COMSOL announced the latest version of COMSOL Multiphysics Version 5.4, which in addition to two new products provides performance improvements and additional modeling tools.

This ROG BLOG is Part One of a two part series introducing the key criteria to consider when selecting a PCB substrate which will minimize circuit losses for 77 GHZ radar PCB antenna applications.  First we will discuss components of PCB circuit loss, and then introduce six key material properties critical to developing low loss millimeter wave circuits at 77 GHz.