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SweGaN is a spin-off from Linköping University that recently announced a new GaN-on-SiC HEMT heterostructure, QuanFINE ™, built on the concept of a GaN−SiC hybrid material that combines the high-electron-velocity thin GaN with the high-breakdown bulk SiC. According to their web site, the structure is realized by the company’s unique hot-wall MOCVD process and shown good result in both high-frequency and power transistors. 

Many of us have seen exciting applications for radar to see through walls, detect cancer, or scan people for hidden weapons. But much of this technology has to date been too expensive for wide use and adoption in commercial markets. Vayyar is changing all of that with their low cost radar on chip.

Unwanted levels of PIM can result from several different factors, including the amplitudes and frequencies of the multiple transmitted tones, the configuration of a circuit’s transmission lines, and the current density and power level of the application. Multiple signal tones are usually denoted by their fundamental frequencies, such as f1 and f2, with the frequencies of their PIM spurious signals resulting from the differences between different harmonics of the fundamental tones. Learn about how PCB designs can reduce PIM.

I had the opportunity to speak at the IEEE sponsored 5G World Forum last week in Santa Clara.  My talk focused on areas of research not necessarily related to the current 5G specification or 3GPP Release 15. The purpose of my presentation was not to rehash 5G, but to instead highlight areas that will help 5G reach its potential.

I recently covered how cloud services are helping accelerate design services with virtual CAE, and now we have seen an announcement from GradientOne about accelerating hardware utilization and providing insights into test data using their cloud platform.

OnScale is a leader in Cloud computer aided engineering (CAE), running multi-physics solvers on its Cloud HPC platform running on Amazon Web Servers. Their platform helps engineers to accelerate innovation for next-generation products such as 5G smartphones, IoT, biomedical devices and driverless car products by greatly reducing the solving time with massive computing power and using optimized algorithms.

This week two separate news items, one from Tektronix/IEMN and the other from Nippon Telegraph and Telephone Corporation (NTT), both announced development of 100 Gbps “wireless fiber” solutions. Each took a different route with Tektronix and IEMN (a French research laboratory) demonstrating a single carrier wireless link with a 100 Gbps data rate signal at 252 to 325 GHz per the recently published IEEE 802.15.3d standard while NTT used a new principle, Orbital Angular Momentum (OAM) multiplexing at 28 GHz  with MIMO technology.