MTT-S IMS

Cirexx to present ECLIPS technology at IMS2015

Cirexx International announced that they will be presenting their ECLIPS technology at IMS2015 in Phoenix, Ariz., May 17-22. Cirexx will be in Booth # 2023. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave printed circuit boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.


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NI AWR Design Environment V12 pre-release now available

NI (formerly AWR Corp.), announces that NI AWR Design Environment™ V12—the first major software release in 2015—is now available as a pre-release to select customers, partners and evaluators. Previewing for the first time at International Microwave Symposium 2015 (IMS2015) at NI Booth #2431, this latest release boasts new load-pull and antenna- and radar-specific features, as well as ease-of-use improvements, speed enhancements and third-party integration flows.


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MACOM announces fourth generation GaN technology

Next-generation GaN on Silicon technology rivals performance of GaN on Silicon Carbide, offering greater than 70% efficiency and 19dB Gain at a cost structure below incumbent LDMOS technology

M/A-COM Technology Solutions Holdings, Inc. (“MACOM”), a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, announced its fourth generation of Gallium Nitride on Silicon (GaN on Si) technology.


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Coilcraft to showcase broadband conical inductors at IMS2015

Coilcraft will be highlighting their newly expanded line of BCL/BCR Series conical inductors at IMS 2015 next week in Phoenix, Arizona. The products are offered in two configurations. The BCR Series has a full-length cap to protect the coil and provide a large surface for pick and place. The BCL Series features “flying leads” to allow precise positioning and adjustment of the mounting angle.


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Wearable electronics a key focus at the 2015 International Microwave Symposium

The IEEE MTT-S 2015 International Microwave Symposium (IMS) will debut Microwave Week’s first Wearables + Wireless Pavilion featuring emerging wearable electronics that utilize RF and microwave technologies. Curated and sponsored by Intel and Wireless Design and Development, the pavilion will be located at Booth #307 in the Phoenix Convention Center as part of the symposium May 17-22, 2015.


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