Coupling Wave Solutions S.A. (CWS) announced that STMicroelectronics has adopted the WaveIntegrity™ analysis tools to remove risk caused by on-chip, package and PCB parasitics. Following multiple evaluations, STMicroelectronics is deploying WaveIntegrity across multiple groups.
Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced from Mobile World Congress in Barcelona the latest version of UltraCMOS® process technology — Semiconductor Technology Platform 8 (STeP8). STeP8 technology shows a 36 percent improvement in RonCoff performance over STeP5 technology announced just one year ago — dramatically improving the linearity, insertion loss, and isolation capabilities of Peregrine’s RFIC products.
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced the addition of multiple new products to RFMD's industry-leading portfolio of envelope tracking (ET) power management and power amplifier (PA) solutions.
Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced from Mobile World Congress in Barcelona it has expanded its DuNE™ Digitally Tunable Capacitor (DTC) product line with six second-generation devices for antenna tuning in 4G LTE smartphones.
Agilent Technologies Inc. announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs. The Agilent M9252A DigRF host adapter allows developers to speed testing and analysis of RFICs used in cellular phones, tablets and other mobile devices.
To meet the demanding needs of pyrotechnic engineers, Vishay Intertechnology Inc. introduced a new massive electro-pyrotechnic ignitor chip (MEPIC) resistor offering Joule effect or flash ignition for fast firing times down to 250 µs.
Richardson RFPD Inc. announces its participation and the line-up of suppliers and products it will feature at IIC China 2013, to be held at the Shenzhen Convention & Exhibition Center, Shenzhen, China, February 28 to March 2, 2013.
Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include substrate scaling, pad geometry scaling and part value selectability.
Qualcomm Incorporated announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., introduced the Qualcomm RF360 Front End Solution, a comprehensive, system-level solution that addresses cellular radio frequency band fragmentation and enables for the first time a single, global 4G LTE design for mobile devices. The RF front end solution includes the industry’s first envelope power tracker for 3G/4G LTE mobile devices, a dynamic antenna matching tuner, an integrated power amplifier-antenna switch, and an innovative 3D-RF packaging solution incorporating key front end components.