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Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include  substrate scaling, pad geometry scaling and part value selectability.

Cree Inc. and Eta Devices Inc. will demonstrate the world’s most efficient reported power amplifier for mobile base stations at the 2013 Mobile World Congress, February 24-28 in Barcelona, Spain.

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced the company will present its expanding portfolio of industry-leading radio frequency (RF) components for smartphones, tablets and other data-centric mobile devices at the 2013 Mobile World Congress (MWC 2013).

Altair Semiconductor (www.altair-semi.com), a developer of high performance, single-mode LTE chipsets, announced the launch ofa new family of chipsets, which includes two new baseband processors – the FourGee™-3800 and FourGee™-3802 – and a new radio chip – the FourGee™-6300.

ABI Research forecasts 8.6 billion smart cards will ship in 2013; a combined number spanning all smart card markets. Of total shipments, 16 percent are forecasted to use a contactless interface, rising to 30 percent in 2018. Government ID, transportation and ticketing, and payment cards continue strong double-digit growth in contactless adoption.

Custom MMIC, (www.CustomMMIC.com), a developer of performance-driven monolithic microwave integrated circuits (MMICs), is adding a new 5 to 11 GHz ultra-low noise amplifier to its growing line of high-quality products. The CMD132P3 presents an ultra-low noise figure of 1.3 dB, delivers greater than 20 dB of gain across the entire bandwidth, and has a corresponding output 1 dB compression point of +10 dBm.

Analog Devices Inc. introduced a clock buffer and divider IC that combines high-speed, extremely low jitter (41 fs across the 12-kHz to 20-MHz band) and selectable division capability.

Richardson RFPD Inc. announced it has completed an agreement to distribute Silicon Carbide power products from Cree Inc. Under the agreement, Richardson RFPD will distribute Cree's SiC Schotty diodes, MOSFETs and power modules worldwide.

Nano Materials International Corp. (NMIC) announced that it has shipped its 10,000th aluminum diamond metal matrix composite (MMC) heat spreader for use in gallium nitride (GaN) RF power transistors and MMICs.