We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
RF Micro Devices Inc. announced the expansion of the company's family of multimode multi-band (MMMB) power amplifiers (PA) to include the highly integrated RF7388 3G/4G MMMB PA.
Agilent Technologies Inc. announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs. The Agilent M9252A DigRF host adapter allows developers to speed testing and analysis of RFICs used in cellular phones, tablets and other mobile devices.
To meet the demanding needs of pyrotechnic engineers, Vishay Intertechnology Inc. introduced a new massive electro-pyrotechnic ignitor chip (MEPIC) resistor offering Joule effect or flash ignition for fast firing times down to 250 µs.
Richardson RFPD Inc. announces its participation and the line-up of suppliers and products it will feature at IIC China 2013, to be held at the Shenzhen Convention & Exhibition Center, Shenzhen, China, February 28 to March 2, 2013.
Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include substrate scaling, pad geometry scaling and part value selectability.
Qualcomm Incorporated announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., introduced the Qualcomm RF360 Front End Solution, a comprehensive, system-level solution that addresses cellular radio frequency band fragmentation and enables for the first time a single, global 4G LTE design for mobile devices. The RF front end solution includes the industry’s first envelope power tracker for 3G/4G LTE mobile devices, a dynamic antenna matching tuner, an integrated power amplifier-antenna switch, and an innovative 3D-RF packaging solution incorporating key front end components.
Cree Inc. and Eta Devices Inc. will demonstrate the world’s most efficient reported power amplifier for mobile base stations at the 2013 Mobile World Congress, February 24-28 in Barcelona, Spain.
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced the company will present its expanding portfolio of industry-leading radio frequency (RF) components for smartphones, tablets and other data-centric mobile devices at the 2013 Mobile World Congress (MWC 2013).
Altair Semiconductor (www.altair-semi.com), a developer of high performance, single-mode LTE chipsets, announced the launch ofa new family of chipsets, which includes two new baseband processors – the FourGee™-3800 and FourGee™-3802 – and a new radio chip – the FourGee™-6300.
ABI Research forecasts 8.6 billion smart cards will ship in 2013; a combined number spanning all smart card markets. Of total shipments, 16 percent are forecasted to use a contactless interface, rising to 30 percent in 2018. Government ID, transportation and ticketing, and payment cards continue strong double-digit growth in contactless adoption.
RSS
To meet the demanding needs of pyrotechnic engineers, Vishay Intertechnology Inc. introduced a new massive electro-pyrotechnic ignitor chip (