RFIC Channel

Hesse launches heavy wire and ribbon bonding services for product development

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.


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Peregrine introduces industry's highest-isolation RF switch for wireless infrastructure market

Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced availability of the industry’s highest-isolation SPDT RF switch for the wireless infrastructure market. The UltraCMOS® based PE42420 RF switch has high isolation of 64 dB @ 4 GHz — an approximately 20% increase over competing devices on the market.* Additionally, the switch features HaRP™ technology enhancements to deliver high linearity, with an IIP3 of 65 dBm.


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TriQuint Achieves Breakthrough GaN-on-Diamond Results

Enables high performance, low heat operation, significantly smaller transistors
TriQuint Semiconductor Inc. announced that it has produced the industry’s first gallium nitride (GaN) transistors using GaN-on-diamond wafersthat substantially reduce semiconductor temperatures while maintaining high RF performance. TriQuint’s breakthrough technology enables new generations of RF amplifiers up to three times smaller or up to three times the power of today’s GaN solutions.
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