Test & Measurement Channel - Leading Manufacturer News, Articles & Content

SUSS and 3M Form 3-D Packaging Bond

3M and SUSS MicroTec have agreed to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultra-thin wafers required for 3-D packaging. As part of this non-exclusive agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell...
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Rohde & Schwarz Displays System for Generation and Analysis

Rohde & Schwarz demonstrated a complete system for generating and analyzing user-defined and standard independent Orthogonal Frequency Division Multiplex (OFDM) signals at its booth (2407) at the International Microwave Symposium. The system consists of R&S signal generators and a signal analyzer using OFDM specific measurement software and covers microwave...
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