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The Design Challenges of RF SIPs and Multi Chip Modules

February 10, 2010
Malcolm Edwards, AWR Corp.
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RF SiP and MCMs integrate CMOS integrated circuits (ICs) for digital circuits and GaAs or SiGe devices for RF and microwave circuits with soft-board laminates and LTCC packages. Software used to design these complex circuits must seamlessly bring together synthesis, simulation, and verification solutions via a single interface ensure optimum component design and placement in each technology.
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AWR Relaunches Popular High Frequency Design Blog

February 9, 2010
AWR
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AWR® , a leader in high-frequency electronic design automation (EDA), announced that Sherry Hess, Vice President of Marketing, has re-launched her popular guest blog (first appearing on Microwave Journal ’s website) on the AWR website. The new AWR blog is designed to provoke discussion of industry issues and trends...
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Sapphicon Semiconductor and AWR Partner

February 9, 2010
Sapphicon and AWR
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Sapphicon Semiconductor , a designer and manufacturer of high performance integrated circuits based on silicon-on-sapphire (SoS) process technology, and AWR Corp. , a leader in high frequency EDA, introduced process design kits (PDK) for AWR software that support Sapphicon’s advanced SoS processes. AWR’s Analog Office® RFIC design software is...
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Mentor Graphics Enhances Signal and Power Integrity Solution with Full-wave 3D Analysis

February 5, 2010
Mentor Graphics Corp., Wilsonville, Ore.
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Mentor Graphics Corp. , a market and technology leader in printed circuit board (PCB) design solutions, announced delivery of full-wave 3D electromagnetic (EM) analysis functionality addressing the needs of the industry’s most advanced designers of high-performance electronic products. These EM analysis enhancements address the advanced simulation needs of engineers...
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