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Agilent Technologies Inc. announced a strategic partnership with ASTER Technologies to enable integration of ASTER's TestWay Coverage Analyst with Agilent's printed circuit board assembly test platforms, enabling seamless test coverage analysis across test platforms. The TestWay Coverage Analyst provides a push-button test coverage analysis tool for coverage estimation (pre-test...

With just over a month to go it has been announced that one of the topics that will be addressed at the next ARMMS RF and Microwave Society Conference will be microwave components for use in satellite communications systems. During the two-day event, which will be held on Monday...

Gemalto and NXP have entered into an agreement whereby NXP will transfer its mobile services business to Gemalto. The related unit based in Sophia Antipolis, France, will continue to develop and market software and service solutions compliant with the MIFARE4Mobile™ interface specifications, which manage MIFARE™ based applications in Near...

Aeroflex announced the latest software features for the 3500 series handheld radio test set. Software version 3.5.1 includes new features to extend the test capabilities of the 3500 Series, such as a new Tracking Generator Option, which allows users to test and align duplexers quickly in the field. The...

DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, and CAD Design Software have announced the integration of DuPont™ GreenTape™ low temperature co-fired ceramic (LTCC) materials and manufacturing processes into CAD Design Software’s Electronic Design Automation (EDA) design tools for Ceramic (Hybrid/MCM – LTCC) circuit design. By incorporating the...

The Embedded World 2009 Exhibition and Conference that took place in Nürnberg, Germany from 3 to 5 March seemed relatively oblivious to the current economic turndown. At the time of writing official attendance figures were not available, but with 704 exhibitors representing a 4 per cent increase on 2008...

This article describes the design flow for a high speed connector using several simulation tools. The goal is to enable its first pass design without time-intensive and costly iteration steps. In addition to other simulation tools, CST MICROWAVE STUDIO® (CST MWS) is used during various stages of the design...

Agilent Technologies Inc. announced the availability of SystemVue 2008.12, a new platform for electronic system-level (ESL) design. The new platform delivers modeling, design-flow improvements and baseband IP libraries that can cut months from physical layer (PHY) design time for high performance communications algorithms and system architectures in both wireless...

Wireless operators deploying next generation technologies will be evaluating upgrades to their backhaul networks for better enabling bandwidth-intensive communications, a process simplified by the next generation microwave planning software solution, iQ.link®XG Version 9.0, from Comsearch , a CommScope Inc. company. iQ.linkXG helps network engineers easily deploy microwave links by...