Software & CAD

IEEE Signs Merger Agreement with Eta Kappa Nu Honor Society

IEEE , the world’s largest technical professional society, signed a merger agreement with the honor society Eta Kappa Nu (HKN), a nonprofit, public-service organization comprising nearly 200 university chapters. The merger, which will go into effect by mid-2009 pending final approval, will make HKN the official honor society of...
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Remcom Announces Next Gen EM Simulation Software

Remcom announces the release of XFdtd® 7.0 (XF7), a new electromagnetic simulation tool for antenna design and analysis, biological EM analysis, microwave circuit design, and other EM simulation applications. XF7 marks a departure from other standard 3D EM solvers with a simplified and streamlined user interface, cross-platform functionality, and...
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WIN Announces Foundry PDK for Use with Agilent's ADS

WIN Semiconductors announced the availability of a process design kit (PDK) for H2W PH50-00 process, which includes Enhancement/Depletion-mode PHEMT and HBT process technology. The WIN PDK, developed for use with Advanced Design System (ADS) EDA software from Agilent Technologies, enables high-frequency RF and microwave designers to create compact integrated...
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Mentor images

Designing RF, Mixed-technology Printed Circuit Boards

Printed circuit boards with both analog and digital circuitry are nearly universal. Recently, integration of RF circuitry in addition to the mixed analog and digital circuits has become more common. Problems arise because the PCB design tools have been ignorant of RF shapes printed on the board and a great deal of manual work was required to achieve a functioning product. Mentor has teamed with RF Design Tool suppliers, such as Agilent, to bring to market the first integrated RF-PCB system tool.
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Agilent EEsof EDA & RF SoP Co-design

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...
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