RF & Microwave Industry News

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RFMW announced design and sales support for a low noise, high gain, wide bandwidth MMIC amplifier IC, the Qorvo QPL7433.

IGaN’s technology has the unique advantage of achieving very low conduction loss meeting the industry standards for GaN HEMT on Si for RF applications. Recently processed IGaN's 150 mm GaN on Si HEMT wafers have achieved a conduction loss of 0.15 dB at room temperature and 0.23 dB at high temperature for an operating frequency of 10 GHz.

RFMW announced design and sales support for Qorvo’s packaged broadband driver amplifier fabricated on Qorvo’s QGaN15 0.15 um GaN on SiC process

Cinch Connectivity Solutions announced the introduction of the SMP and SMPM Vertical Launch, PCB Compression Connectors. The innovative solderless design allows for excellent RF performance, and these connectors are available in both common microwave transmission line formats—Microstrip and Stripline. 

TE Connectivity is shaping its card edge power connector portfolio into a comprehensive one with the introduction of single-beam, high-density (HD) heightened, HD plus (HD+) 5- and 8- beam card edge power connectors.

Benetel announced that it has joined the Open RAN Policy Coalition to support the development of a secure and global ecosystem for 5G. 

Rohde & Schwarz finished its 2019/2020 fiscal year (July to June) with EUR 2.58 billion in revenue. The company has grown for the third year in a row with a 20 percent revenue increase.