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The LoRa Alliance®, the global association of companies backing the open LoRaWAN® standard for internet of things (IoT) low-power wide-area networks (LPWANs), announced that it published the LoRaWAN TS1-1.0.4 Link Layer (L2) Specification.
Viavi Solutions Inc. announced the company successfully participated in a global O-RAN plugfest hosted by several Tier-1 communications service providers and the O-RAN ALLIANCE.
OnScale announced the release of the OnScale Solve, the web-based cloud engineering simulation platform bringing to engineers powerful multiphysics solvers and scalable cloud supercomputer resources.
BT and EE customers are set to benefit from Ericsson 5G Radio Access Network (RAN) connectivity following the company’s selection as BT’s 5G RAN provider in the U.K. capitals London, Edinburgh, Belfast and Cardiff and other major cities.
The newly re-elected leaders of the Wireless Broadband Alliance (WBA) believe the world is on the verge of becoming one giant global Wi-Fi network, and will outline a powerful and ambitious vision for the future of Wi-Fi at the Alliance’s 37th annual Wireless Global Congress, October 28th.
Akoustis Technologies, Inc. announced that it has been awarded a new, multi-year direct-to-phase 2 (DP2) contract from DARPA to further develop Akoustis’ technology through the development of a Piezo MEMS process design kit (PDK) for the company’s proprietary and patented XBAW™ process.
Tektronix, Inc. announced its second-generation IsoVu isolated oscilloscope probes, the TIVP Series, which significantly advance the capabilities of the ground-breaking probes first introduced in 2016.
Advanced Micro Devices Inc. agreed to buy Xilinx Inc. for $35 billion in stock, one of the largest chip acquisitions ever, a transaction that gives the former industry also-ran more products and a bigger research budget to challenge leader Intel Corp.
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