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Keysight Technologies, Inc. announced that the company was first to be approved by the Global Certification Forum (GCF) for 5G universal subscriber identity module (USIM) application toolkit (USAT) test cases.
GLOBALFOUNDRIES® (GF®) and Soitec announced a multi-year supply agreement for 300 mm radio frequency silicon-on-insulator (RF-SOI) wafers, allowing GF to further expand its critical role in providing solutions for the next-generation mobile phone market.
Qorvo® has been selected by the U.S. government to create a state-of-the-art heterogeneous integrated packaging (SHIP) production and prototyping center for RF assemblies, a program valued at $75 million.
Passive Plus, Inc. (PPI) has expanded its broadband components to include one of the industry’s smallest 0.010” x 0.005” broadband capacitor part characterized for RF performance.
Lextrum, Inc. has reached another development milestone, completing the hardware and firmware integration of its in-band full duplex passive suppression and active cancellation technology.
NEL Frequency Controls, Inc. has released ultra low phase noise OCXOs with low power in a miniature 15 x 21 x 11 mm DIL14 compatible package, at 10 MHz and 100 MHz output frequencies.
Ampleon announced the BLP2425M10S250P, a 250 W RF power transistor for solid-state cooking and industrial, scientific and medical (ISM) applications in the 2,400 MHz to 2,500 MHz frequency band.
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