Industry News

Hittite on Display at MTT-S IMS 2007

For IMS 2007, Hittite Microwave will be using its newly designed 10' x 20' corporate exhibit. The new exhibit features a fresh design and innovative features to showcase Hittite's products and demo pieces. The company will be introducing new product lines and a new product family. Hittite is proud...
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Linux Transforming the Mobile Phone Industry

According to the report, “Linux Ecosystem to Drive the Cell Phone Industry,” from the Strategy Analytics Handset Component Technologies service, Linux-based Smart mobile phones are set for strong growth over the next few years. “Linux has begun to open doors for handset manufacturers, developers and mobile operators. Strategy Analytics...
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Agilent’s New Signal Analyzer Features 10x Increase

Agilent Technologies Inc. introduced an enhanced model of the world’s fastest signal source analyzer, the Agilent E5052A.
Agilent Technologies Inc. introduced an enhanced model of the world’s fastest signal source analyzer, the Agilent E5052A. It features a tenfold improvement in measurement throughput and more precise analysis functions than its predecessor, as well as the best performance in clock jitter measurement with the lowest jitter noise floor...
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Hesse & Knipps Demonstrate Bonder

Hesse & Knipps GmbH Semiconductor Equipment , a manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, announced that it will be demonstrating its BONDJET BJ820 fully automatic thin wire bonder at the 2007 International Microwave Symposium (IMS). The demonstration will take place in booth...
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