Articles Tagged with ''designers''

At very high frequencies, signal propagation and transmission line effects on PCBs tend to happen earlier and become prominent. PCBs may also exhibit multiple resonances and power decoupling becomes more challenging than ever before. To overcome these challenges, PCB Designers and Engineers can count on the new EMSCAN EHX to verify the impact of rerouting signals or modifying PCB layout or materials used on the PCBs.

AWR Corp., the innovation leader in high-frequency EDA software and Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter-wave devices, announce the availability of Version 10.1 of the Modelithics COMPLETE Library of passive and active device models for AWR’s Microwave Office® high-frequency design software.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming International Microwave Symposium (IMS) 2013 to be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, and the ARFTG Microwave Measurement Conference. The exhibition takes place June 4-7, 2013 at the Washington State Convention Center located at 800 Convention Place in Seattle.

Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).

Texas Instruments Inc. (TI) introduced the industry’s fastest 4-channel, 14-bit analog-to-digital converter (ADC), clocking in at 250 MSPS. The high-density ADS4449 enables receiver systems to support up to 125 MHz of instantaneous bandwidth in extremely small forms, such as multiple input and multiple output (MIMO) base stations and munitions guidance, or in greater density applications, such as active electrically scanned array (AESA) and other phased-array radars.

EHX is the only real-time EMC and EMI diagnostic tool that enables them to test ultra-high speed (> 2GHz) PCBs their lab-bench. With EHX, Wi-Fi designers and manufacturers can for example conduct tests and debug EMC and signal integrity problems up to the third harmonic. 

A new white paper from AWR, “Understanding and Correctly Predicting Critical Metrics for Wireless RF Links,” highlights the advantages of using Visual System Simulator™ (VSS) RF system simulation software for detailed insight into the full performance of an RF link in next-generation wireless products.

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.

Rogers Corp. will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall (September 26). Rogers Corporation (www.rogerscorp.com) welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.