Articles Tagged with ''platform''

Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, announced that HTC and Samsung are ramping SkyOne™, a highly customizable, fully optimized front-end solution, in several of their recent smartphone launches.  The SkyOne™ platform, which integrates all RF and analog content between the transceiver and antenna, reduces complexity, size and time-to-market for customers with demanding architectures for advanced mobile applications.

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany. 

ABI Research’s GNSS IC vendor matrix concluded that, overall, Qualcomm is the leading GPS IC vendor, followed by Broadcom in second place, and CSR in third. The vendor matrix compares companies on 15 criteria across the broader categories of GNSS Innovation and Implementation. Qualcomm’s domination of cellular GPS IC shipments courtesy of its embedded platform strategy, coupled with its strong IZat and Gimbal platforms means it is well placed to remain at the top in 2013/14.

Exalt Communications, the leading innovator of next-generation wireless backhaul solutions, unveiled ExpandAir®, the company’s new point-to-multipoint (PMP) platform. The first system available in the platform is a sub-6 GHz non-line-of-sight offering based on Exalt’s exclusive eMIMO® technology, which brings performance, reliability, and security to a new level for value-priced point-to-multipoint microwave backhaul, accelerates deployment time, and reduces infrastructure costs.

CommScope has stripped the complexity out of integrating a distributed antenna system (DAS) into a macro wireless network by upgrading its ION® platform into a simple to use, plug-and-play solution. The new ION-U features integrated guidance and intelligence, enabling wireless network operators to design, plan, deploy and optimize a DAS more quickly and efficiently and at a lower total cost of ownership.

Mobile device design is increasingly reliant on integrated platforms, which are chipsets based on combinations of application processor, baseband processor, and wireless connectivity technologies. In 2012, 19 percent of handsets shipped were based on an integrated platform; set to more than double to 46 percent in 2018.

Anritsu Corp. announces it is the first test equipment manufacturer to exceed 10,000 validated protocol conformance test cases across all Work Items and frequency bands for LTE and LTE Inter-RAT. The milestone, achieved at the recent GCF CAG#33 meeting in Farnborough, UK, was accomplished on the ME7834 Mobile Device Test Platform.

The R&S CMW500 wideband radio communication tester is a multistandard test platform that developers can use to test user equipment for compliance with all wireless communications standards. Rohde & Schwarz has developed a new and innovative graphical test script development tool for this platform that does not require any programming experience: R&S CMWcards.

Elma Electronic Inc., in cooperation with Pentek Inc. and Concurrent Technologies, has developed a small form factor (SFF), OpenVPX-based signal acquisition system for processing and recording applications. 

The market for mobile handset IC, including platform and connectivity ICs, surpassed $32 billion in 2011 and is forecast to grow a further 11 percent in 2012 to reach $35.7 billion. Growth is being led largely by the smartphone segment, with ultra-low end handsets also growing strongly. “Qualcomm stands out as the market leader with 26 percent overall share in 2011,” stated Peter Cooney practice director, of semiconductors,  “its continuing focus on the handset market and in particular its efforts to increase platform integration look set to further strengthen Qualcomm’s hold on the market in the near term.”