Across industries including semiconductors, automotive, aerospace and defense, and communications, engineers are designing increasingly complex systems that span from MHz to THz applications. As demands for miniaturization, densification and intelligent connectivity continue to grow, so do the challenges.
Ansys delivers advanced RF, microwave and package simulation solutions that extend from chip to platform — integrating electromagnetics, thermal and mechanical domains. Ansys' gold-standard multiphysics ecosystem enables AI-driven digital twins, system architecture modeling and cloud-based collaboration, supporting faster innovation with proven accuracy and scale.
Visit Ansys’ booth to:
- Explore the latest in RF and microwave systems, chip thermal management and microwave component simulation and optimization
- See live demos and presentations from customers, partners and Ansys experts at booth #1543
- Be sure to catch their in-booth theater sessions, packed with expert talks and customer stories.
In-Booth Presentation Schedule
| Date | Time | Speaker | Presentation Title |
|---|---|---|---|
| Tuesday, June 17 | 9:30 - 9:50 AM | Wilfredo Rivas-Torres, Keysight | RF Channel Modeling with Dual Polarization Array for 5G and beyond Research |
| Tuesday, June 17 | 3:00 - 3:20 PM | Sandeep Sankararaman, Samtec | "Balancing the conflicting demands of Watt and Kelvin without losing your sanity" |
| Tuesday, June 17 | 4:00 - 4:20 PM | Arien Sligar, Ansys | Topic: Perceive EM |
| Wednesday, June 18 | 9:30 - 9:50 AM | George Shaker, University of Waterloo | Perceive, Predict, Perfect: Human-Centric Radar Design using Digital Twins and Machine Learning |
| Wednesday, June 18 | 3:00 - 3:20 PM | Larry Williams, Ansys | "Electromagnetic Intelligence for Connectivity without Compromise" |
| Wednesday, June 18 | 4:00 - 4:20 PM | Andreas Roessler, Rhode & Schwarz | Digital Twins for AI-RAN |
| Thursday, June 19 | 9:30 - 9:50 AM | Diamond Liu, SynMatrix | Synmatrix: Mastering complex RF filter design with an all-in-one solution |