StratEdge Corporation will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in booth 4089 at the International Microwave Symposium (IMS), being held in Denver, Colo., from June 21-23. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as GaN, GaAs and SiC. These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive and down-hole. 

"IMS is a show that StratEdge has regularly supported for decades. Our experts are excited to discuss your high-frequency, high-power packaging needs in person," said Casey Krawiec, VP of global sales at StratEdge. "We manufacture our packages to exacting specifications, using post-fired ceramics with features that are laser cut to control tight tolerances, thermally-enhanced metal bases that dissipate heat, and electrical transition designs that provide exceptionally low electrical losses. To further ensure optimized performance, StratEdge Assembly Services can package your devices in our new cleanroom, which is equipped with the latest precision wire bonding and die attach systems."