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The company, formerly known as Cree, Inc. (Nasdaq: CREE), officially launches under its new name, Wolfspeed, Inc., with the support of a comprehensive, multi-channel, integrated marketing campaign.
X-FAB Silicon Foundries is now able to support volume heterogeneous integration via micro-transfer printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint.
GlobalFoundries announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years, including immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity.
pSemi® announced the opening of a new design center in Chennai, India, to support the company's growing demand for semiconductor products for 5G and IoT applications.
BAE Systems received a $247 million contract from the U.S. Space Force’s Space and Missile Systems Center to design and manufacture an advanced military GPS receiver and next-generation semiconductor.
Veeco Instruments Inc. announced that National Chiao Tung University (NCTU), based in Hsinchu, Taiwan, has selected Veeco to be an essential collaborator in their initiative to drive Taiwan’s semiconductor production through 2035.
NI and Soliton Technologies announced a strategic agreement to accelerate new software offerings for semiconductor design and validation, including new productivity tools and standardized frameworks.
ON Semiconductor Corp., driving energy efficient innovations, announced its acquisition of SensL Technologies Ltd.. The acquisition is expected to be immediately accretive to ON Semiconductor's non-GAAP earnings per share.
