We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
The White House touted the U.S. government's plan to spend $11 billion on semiconductor-related research and development and said it was launching the $5 billion National Semiconductor Technology Center.
Gel-Pak launched of its Gel-Probe products, featuring enhanced probe tip cleaning and polishing solutions designed for semiconductor test applications.
IDTechEx's new report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications," thoroughly explores the latest innovations in semiconductor packaging technology, covering key technical trends, analyzing the value chain, evaluating major players and providing detailed market forecasts.
NI announced a new initiative to deliver real-time semiconductor analytics solutions at the edge using their NI Global Operations with initial integration with leading ATE vendor, Teradyne.
Kyocera International, Inc. announced an expansion of its U.S. semiconductor and microelectronic device assembly capabilities at its manufacturing operations in San Diego, Calif.
The 2023 IEDM technical program, supporting the theme, “Devices for a Smart World Built Upon 60 Years of CMOS,” will consist of more than 225 presentations plus a full slate of panels, focus sessions, tutorials, short courses, a career luncheon, supplier exhibit and IEEE/EDS award presentations.
On September 29, the CHIPS Program Office (CPO) of the U.S. Department of Commerce (DOC) issued the second of two Notices of Funding Opportunity (NOFOs) targeted toward the semiconductor supply chain.
Rohde & Schwarz is participating in an Important Project of Common European Interest of the European Commission in the field of microelectronics and communications technology.
IDTechEx released the "Advanced Semiconductor Packaging 2023-2033" and "Materials and Processing for Advanced Semiconductor Packaging 2024-2034," reports, encapsulating their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.
