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With the Proteus-IV and Ophelia-IV components, Würth Elektronik presents two new high performance RF modules based on the latest Nordic nRF54L15-SoC semiconductor.
Peraso Inc. announced that its 60 GHz mmWave semiconductor technology has been selected by InTACT for use in a new drone Identification Friend or Foe (IFF) system designed to operate in highly contested electronic warfare environments.
Yole Group announced the release of its annual market and technology report, "Status of the Compound Semiconductor Industry 2026 – Focus on Substrates and Epiwafers," highlighting sustained structural growth through 2031.
Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.
Yole Group announced the release of its new technology and market report, Glass Materials for Semiconductor Manufacturing 2025, a comprehensive study analyzing the rapid rise of glass as a strategic material in semiconductor processes and permanent device architectures.
Greek semiconductor design company Circuits Integrated Hellas has joined Space South Central, one of the U.K.s’ largest regional space clusters, to strengthen its ties with the U.K.’s growing semiconductor and space manufacturing sectors.
MACOM Technology Solutions Inc. announced that it has entered into an agreement with HRL Laboratories to license and manufacture HRL’s proprietary 40 nm T3L GaN-on-SiC process technology.
Northrop Grumman’s Microelectronics Center is now open for external aerospace and defense companies to access the company’s three U.S. government-accredited semiconductor manufacturing facilities.