Items Tagged with 'StratEdge'

StratEdge Corporation announced that it will exhibit at three upcoming industry events: CS Mantech, May 18–20, Portland, Ore., Booth 418; Space Tech Expo USA, June 3–4, Anaheim, Calif., Booth 323; and IEEE International MTT Symposia (IMS), June 9–11, Boston, Mass., Booth 23060.

StratEdge Corporation is set to showcase its latest packaging technology for high frequency applications at several industry conferences in May. 

StratEdge Corporation is set to showcase its off-the-shelf line of molded ceramic packages at European Microwave Week.

StratEdge will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in booth 2628 at IMS2023.

StratEdge announced that it has extended the performance range for the leaded power amplifier (LPA) family of packages from DC to 23 GHz to 28 GHz. 

StratEdge Corporation announced that its off-the-shelf line of glass side wall packages, called molded ceramic packages, can be configured to meet the requirements for chips with frequencies up to 18 GHz. 

StratEdge Corporation will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in booth 4089 at IMS2022.