StratEdge Corporation announced that it will exhibit at three upcoming industry events: CS Mantech, May 18–20, Portland, Ore., Booth 418; Space Tech Expo USA, June 3–4, Anaheim, Calif., Booth 323; and IEEE International MTT Symposia (IMS), June 9–11, Boston, Mass., Booth 23060.

StratEdge will showcase its complete line including post-fired ceramic packages, lower-cost molded ceramic packages, and gold plated mounting tabs for extremely demanding GaAs and GaN devices. The post-fired ceramic semiconductor packages operate from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and efficient operation. The company will also be available to discuss molded ceramic package options for RF and microwave applications up to 18 GHz. StratEdge's molded ceramic packages provide designers with a broad range of high-reliability options for defense, aerospace and other harsh-environment applications.

StratEdge's gold plated tabs support eutectic die attachment of GaN and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi). For chip-on-board applications, the chip is attached to the thermally conductive tab before the tab is installed onto the board. This helps ensure that the critical first-level interface between chip and system is optimized for maximum device performance.

"Engineers working with GaN, GaAs, and other compound semiconductor devices need packaging," said Tim Going, president of StratEdge. "CSMantech, Space Tech Expo and IMS all give us the opportunity to meet directly with customers designing advanced devices for RF, microwave, space, defense and other demanding applications."

Attendees are invited to visit StratEdge at CS Mantech, Space Tech Expo USA and IMS to discuss application-specific packaging needs, die attach requirements, molded ceramic package options and high-reliability assembly capabilities.

For more information, contact StratEdge at info@stratedge.com or visit www.stratedge.com.