The International Microwave Symposium (IMS) (June 21-23) on-site in Denver, Colo. is only three weeks away. IMS is part of the Institute of Electrical and Electronics Engineers’ (IEEE), the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity, Microwave Week. IMS is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops and tutorials, as well as numerous social events and networking opportunities. For Indium Corporation, this is one of their biggest shows for applications using gold-based products, and look forward to networking with customers and learning about new applications within this exciting market.

Indium Corporation will be promoting products developed to solve common issues facing companies that are producing technology for the RF/micro application sector—controlling thermal management of and maintaining strong solder joints in the hardware. Our AuLTRA® ThInFORMS™ are premium 80Au/20Sn preforms for die-attach applications that improve thermal transfer and overall operational efficiency, as well as reduce voiding, solder volume and wicking up the die. Our off-eutectic alloys, AuLTRA75 (75Au/25Sn), AuLTRA78 (78Au/22Sn) and AuLTRA79 (79Au/21Sn) work in conjunction with thick gold plating on GaN dies to ensure strong solder joints.

Additionally, Indium will be introducing their Au-Based Precision Die-Attach (PDA) Preforms. These PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. PDA preforms—built to stringent tolerances—are essentially burr-free and very precise in solder volume, yielding excellent bondline thickness control, solder bonding and thermal transfer.

Indium will be at booth #9012, and while you're at it, swing by the Microapps stage for their presentation, The Effect of Semiconductor Laser Thermal Transfer in Relation to AuSn Preform Thickness, on June 21 at 11:45am.