Rogers Corp. announced Technical Marketing Manager, John Coonrod, will present Critical Material Properties for 5G PCB Applications from 2:30 – 2:45 p.m. on Tuesday, June 4 and The Impact of Glass Weave Effects on mmWave PCBs from 2 – 2:15 p.m. on Thursday, June 6 in the MicroApps Theater at the International Microwave Symposium (IMS2019) in Boston.

In addition, Rogers will be showcasing its latest 5G and autonomous vehicle materials and other new products in Booth 448 during IMS2019, the world’s largest RF and Microwave show, which takes place from Sun., June 2 – Fri., June 7. These products include the recently launched RO4835T laminates, RO4450T bonding materials, CU4000 and CU4000 LoPro foils, as well as RO3003G2, the next generation high-frequency laminates for automotive radar sensor applications.

RO4835T laminates, offered in 2.5, 3 and 4 mil core thicknesses, are 3.3 dielectric constant (Dk), low loss, spread-glass reinforced, ceramic-filled thermoset materials designed for inner-layer use in multilayer board designs, and complement RO4835 laminates when thinner cores are needed. RO4450T bonding materials are 3.2 to 3.3 Dk, low loss, spread-glass reinforced and ceramic-filled, and were designed to complement the RO4835T and the existing RO4000 laminate family; they are available in 3, 4 and 5 mil thicknesses. CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds and provide good outer-layer adhesion when used with RO4000 products.

RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through-hole reliability and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully-cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminate and RO4450T bond-ply have the UL 94 V-0 flame retardant rating and are compatible with lead-free processes.

RO3003G2 high-frequency laminates build on Rogers’ industry-leading RO3003 platform to provide radar sensor designers with improved insertion loss and reduced Dk variation. The combination of Rogers’ optimized resin and filler content along with the introduction of very low-profile ED copper translates to Dk of 3 at 10 GHz (clamped stripline method) and 3.07 at 77 GHz (microstrip differential phase length method).  RO3003G2 laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method. RO3003G2 laminates are an extension of RO3003 laminates that incorporate Rogers’ decades-long experience working with automotive radar customers and understanding the increasing product performance requirements.