Lark RF Technology, a Benchmark company is exhibiting at Booth #2341 at the IEEE MTT International Microwave Symposium (IMS) 2018 where it will be demonstrating its liquid crystal polymer (LCP) high density interconnect (HDI) technology for high frequency circuits from 10 to 100 GHz.
Additional demonstrations will include:
- A comprehensive showcase of Benchmark’s RF High Speed Design Center of Innovation solutions, including its HDI substrate design and fabrication capabilities.
What: Benchmark demonstrating LCP HDI technology at IMS2018
Where: Benchmark Booth #2341, IMS2018, Pennsylvania Convention Center, Philadelphia, Pa.
When: Tuesday, June 12 through Thursday, June 14 from 9:30 a.m. to 5 p.m. (ending at 3:00 p.m. Thursday)
Who: (Interviews available upon request)
- Daniel Everitt, vice president, Lark RF Technology and RF High Speed Design Center of Innovation, Benchmark
- A member of Benchmark’s leading team of engineers
Benchmark is a leading designer and manufacturer of RF and high speed solutions for aerospace and defense, medical, industrial and compute applications through their wholly-owned subsidiary, Lark RF Technology. Capabilities of their RF High Speed Design Center of Innovation include prototyping and design services, breakthrough manufacturing processes in substrate and packaging technologies, mixed microelectronics and complex product assembly and test at one location.