Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), will exhibit in booth #1135 at the IEEE MTT International Microwave Symposium (IMS) 2015, which will be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium and the ARFTG Microwave Measurement Conference. The exhibition takes place from May 17-22 at the Phoenix Convention Center in Phoenix, Ariz. Isola is also a sponsor of the event and will be distributing water bottles at their booth to conference attendees.

The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including presentations of technical papers, workshops and tutorials, as well as a full set of social events. The symposium also hosts a large commercial exhibition featuring over 550 companies.

Representatives from Isola will be at booth #1135 to advise designers on how to select the optimal laminate systems for their RF and microwave designs. Attendees will learn about the latest technological advancements in RF/Microwave-grade laminates, including the company’s newest materials: TerraGreen®, I-Tera® MT RF, Astra® MT and IS680.

In conjunction with Freescale® Semiconductor’s millimeter-wave radar chipset, Isola will host a booth demonstration to highlight the reliable electrical performance of Astra MT in wide field-of-view radar applications for automotive systems. Visitors to the Isola booth can also learn more about the company’s RF Substrate Conversion Program, which provides turnkey calculations, testing, characterizations and material recommendations to assist PCB fabricators and OEMs in converting to Isola’s RF-materials.

In addition, on Monday, May 18, 2015 from 1:00 to 5:00 p.m. Isola representatives will participate in a workshop, “Measurement-Based Modeling for PCB Material Properties”. This workshop brings together leading engineers from academia and industry to explore the latest in measurement-based modeling technology that can improve the accuracy of both measurements and simulations at multi-gigabit data rates. Learn how the top-four signal integrity challenges -- losses, discontinuities, skew, and crosstalk-- can be accurately modeled and measured to answer design questions. The workshop will provide expert insights on how measurement-based models can quickly inform design engineers on the physics that drive the design of high-speed interconnects. Leading chip designers, connector manufacturers and PCB fabricators will demonstrate the importance of driving simulations to match measurements. Participants will also discuss the benefits from successful applications of such new standards as the rapidly expanding PAM4 technology.

For more information, stop by booth #1135 at IMS 2015 or visit