Path to 5G: Design and Test Challenges
Wednesday, May 20, 12:00-1:00 p.m., MicroApps Theater

5G was the word at Mobile World Congress this year as many companies are now including demos in their booths. One interesting example was China Mobile’s tile approach to 5G where they are using transceiver “tiles” (currently 2 channels but going to 8 soon) in an array that can be shaped to blend into the environment and produce massive MIMO arrays. They plan to deploy these “tiles” on the sides of buildings and other structures and can even arrange them in the shape of Chinese characters, as shown in the demo. To view the demo from this year’s Mobile World Congress, visit

There is a lot of controversy in discussing the future of 5G since it is not yet defined.  With planned deployment starting in 2020, most agree that the goals are up to 10 Gbps data rate to the users, 1000× the bandwidth per unit area, connection capacity for billons of devices (for IoT), 1 msec latency and a large reduction in energy use. Of course, high reliability and better coverage are also expected. But will we need that kind of performance for every application and how practical is it to have this kind of performance?

Like last year at IMS, Microwave Journal is organizing a 5G panel session called “Path to 5G: Design and Test Challenges.” This special panel session will take place Wednesday, May 20 in the MicroApps Theater  (Booth 3147) from 12:00-1:00 p.m. on the exhibition floor. This panel of industry experts will examine the challenges to device design and device/system testing for 5G technologies such as mmWave/TeraHertz transceivers, massive MIMO, HetNets/small cells, CoMP, carrier aggregation, AESA radios, SDR, new modulation schemes, reduced power consumption and other technology issues related to next generation cellular communication systems.

Test and measurement experts from Keysight, Rohde & Schwarz and National Instruments will address flexible testing platforms for rapid prototyping along with partnerships with research organizations evaluating 5G technologies and their results to date. Semiconductor experts from MACOM and ADI will address the device challenges such as wideband, mmWave transceivers including the integration, performance and cost issues needed to achieve 5G goals. After opening remarks from the moderator and panelists, the audience will be able to ask questions for an extended Q&A discussion.

The panelists this year are Roger Nichols, 5G program manager for Keysight Technologies; Jin Bains, VP of R&D for RF products, National Instruments; Andreas Roessler, technology manager North America, Rohde & Schwarz; Mark Cloutier, chief scientist, Analog Devices; and Alastair Upton, Vice President of Engineering, Carrier Networks business at MACOM. Our moderator this year will be Eric Higham, Director of Advanced Semiconductor Applications, Strategy Analytics. He will introduce the panelists and direct the Q&A session. Please come by at noon on Wednesday in Booth 3147 and get the latest on 5G research and technology - last year was standing room only so come early to get a seat.