R/flex®1100 high performance flexible circuit materials system combines the desireable properties of thermosetting phoenolic butyral adhesive with rolled annedaled copper and Upilex®-S polyimide film, low in oxygen and moisture permeability. They are UL rated with continuous operating temperatures of 150°C (302°F). The material system exhibits low moisture absorption, good dimensional stability and excellent chemical resistance.

Product Features:
High temperature resistance for continuous operation at temperatures up to 150°C (302°F)
Excellent chemical resistance designed to withstand harsh environments
Low moisture absorption and uniform adhesive thickness for improved electrical performance in critical controlled impedance applications
Improved dimensional stability for close tolerance complex circuitry

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