Ultra low power (ULP) RF specialist Nordic Semiconductor ASA has announced that it is to expand its existing 2.4 GHz RF and ANT™ product line-ups in Q1 2011 with a new set of ultra miniaturized, wafer-level chip scale package (WLCSP) options. Sampling in Q1 2011 and available for volume orders in Q2 2011 will be the nRF24AP2 WLCSP (1-channel and 8-channel) and nRF24LE1 WLCSP (Flash or OTP) options.
The new nRF24AP2 WLCSP package options will represent the world’s small single chip ANT solutions (nRF24AP2-1CHC32 and nRF24AP2-8CHC32) featuring 400 µm pitch (regular array) 32-ball BGAs with a thickness of 0.5 mm and a flat footprint area of just 2.6 by 2.7 mm (7 mm2) that is said to be over five times smaller than the footprints of competing 6 by 6 mm (36 mm2) packaged products.
The new nRF24LE1 WLCSP option will again be a 400 µm (regular array) 32-ball pitch BGA measuring 2.7 by 2.7 (7.3 mm2) in footprint area for the Flash version and 2.6 by 2.7 (7 mm2) for the OTP version. Both devices are 0.5 mm in thickness.
Thomas Embla Bonnerud, Product Manager for ultra low power wireless at Nordic Semiconductor, said, "By expanding our 2.4 GHz RF and ANT product lines with these brand new WLCSP options that will provide chip footprint savings of up to five times compared to competing products – we are enabling our customers to take their end product designs to the next level in terms of size, weight and ultimately end user comfort and convenience that consumers will reward in their purchasing decisions."